REPORTED DEVELOPMENT
DCD: Northrop Grumman wins a $7M DARPA project for diamond-cooled chips
Data Center Dynamics reports that Northrop Grumman won a $7M Phase II DARPA THREADS contract to integrate diamond-based heat dissipation into next-generation defense chips. The report says Phase I demonstrated a 3.3x power boost and Phase II targets further power-density gains. This remains R&D, not data-center deployment.
PRIMARY SOURCEData Center Dynamics ↗
PUBLIC RESPONSE
The current state is media reporting; later primary material will upgrade the status without determining visibility.
- ENTITIES
- REPORTING STATUS
- Media · single source