Report says CXMT has begun HBM3E risk production; volume timing remains unconfirmed

IT Home, citing The Information, reports that CXMT has begun limited HBM3E risk production and could move toward volume output within weeks. The report also says CXMT plans to raise total DRAM manufacturing capacity to 350,000 wafers per month by year-end. CXMT has not confirmed HBM3E specifications, yield, customer qualification, allocation or volume timing, and the 350,000 figure is not HBM3E-only capacity.